In Size E and Size D COM-HPC Server modules, it is offering Intel Xeon D processors for real-time micro-server workloads.
Up to 20 cores are available with up to 1TB of RAM and “double throughput per PCIe lane compared to Gen 3 as well as up to 100GbE connectivity and TCC/TSN support”, according to the company.
Then with Alder Lake 12th generation Intel processors with up t0 14 cores, the company has COM-HPC modules in Size A and Size C, as well as on COM Express Type 6 modules. The integrated Intel Iris Xe graphics has up to 96 execution units – offering up to 129% improvement in GPGPU processing for AI AI algorithms compared with 11th Gen Core processors, said Congatec.
For mini-motherboard users, the company has ‘Conga-PA7′ Pico-ITX boards with Intel Atom x6000E, Celeron, Pentium N or Pentium J Elkhart Lake processors.
“They impress with graphics performance up to three simultaneous displays running at 4kp60 and impressive multi-thread computing power on up to four cores,” said Congatec. “Especially welcomed in real-time industrial markets are TSN [time sensitive networking], Intel TCC [time coordinated computing] and Real Time Systems’ hypervisor support, as well as BIOS configurable ECC.” Operation is from -40 to +85°C.
“Typical targets for these platforms range from next generation of real-time connected, functionally safe self-driving vehicles, to smart manufacturing and material handling applications ranging from collaborative and cooperative robots to substitutive solutions such as robots for through-hole assembly of PCBs,” according to the company.
Congatec can be found on Booth C522, Coex Hall C, at Smart Factory & Automation World
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