Schurter has introduced a through-hole fuse holder specifically designed to be compatible with reflow soldering.
It is branding this as ‘THR’ for ‘through-hole reflow’.
“Highly integrated electronic circuits are almost exclusively assembled with surfact-mount components and soldered in a reflow oven, however, it is sometimes necessary to include through-hole components on the circuit board,” according to the company. “THR components are through-hole components specially designed for automated assembly and high thermal stress in the reflow oven.”
That said, the THR parts are only suitable for reflow up to 245°C, the same as through-hole wave-solderable OGN variants. While some surface-mount OGN fuse holders are limited to this, others can be reflowed at up to 260°C.
During assembly process, paste printed into the vias awaiting through-hole pins, then the component it pushed through the paste, explained Schurter. As the paste melts in the oven, through wetting and capillary forces, liquid solder retracts into the vias and forms the solder joint.
This is a version of the company’s OGN open holder for 5×20 fuses, also designed to be compatible with the tightened glow wire resistance rules of IEC 60335-1.
The new parts are tin-plated and have a 22.5mm pin spacing. A cover is available to convert it to a closed fuse holder.
Schurter is planning on offering THR OGN pre-assembled with a fuse in tape-and-reel blister packaging for fully-automated PCB assembly.
