HARTING 3D-MID Component Carriers enable alternative component positioning and mounting utilizing fully automated assembly and soldering. These 3D molded interconnect devices can replace circuit boards utilizing a 3-dimensional circuit on molded plastic. This 3D shape can allow for more compact integration of electrical components into the available space. HARTING 3D-MID Component Carriers utilize a high-temperature thermoplastic, enabling compatibility with reflow soldering.
Features
- Universal design of substrate
- Customized layout for traces
- High-temperature plastic for reflow soldering
- Shipped in tape and reel as sub-assembly for fully automated SMT processing
more information: https://www.harting.com/DE/en-gb/company/harting-ag-3d-mid
