Little hard information is yet available, but the company has said there will be 12 variants with either silicon carbide mosfets or IGBTs.
One possible configuration
“The configurable power devices include a three-bridge topology that is available in SiC or silicon technologies,” it said. “Key capabilities of these hybrid power drive modules include auxiliary power devices that facilitate in-rush current limiting. Optional add-on capabilities include soft start, solenoid interface drive, regenerative brake switch and thermal sensors for external monitoring circuitry. Power and signal connectors that are solderable directly on the user’s printed circuit board.”
Operating voltage ranges across 650V to 1.2kV, with custom versions up to 1.7kV.
Packaging is the second generation of the company’s ‘HPD’ module, with an AlSiC (aluminium silicon carbide) baseplate, and said to offer more scope for added functions compared to the first generation. The company predicts a three-phase bridge, brake, soft-start power components in 108 x 67 x 25mm.
Power connections are M3 screw-on terminals, with solder pins for low-voltage signals. Potting is silicone gel and there is a parylene coating “which provides environmental protection with a similar performance to a hermetic package”, claimed Microchip.
| Initial named products | Type | Configuration | Rating |
|---|---|---|---|
| MSCGLQ100X065CTYZBNMG | ‘Trench 4 Fast’ Si IGBT |
3phase bridge + actuation |
650V 100A |
| MSCGLQ75X120CTYZBNMG | ‘Trench 4 Fast’ Si IGBT |
3phase bridge + actuation |
1.2kV 75A |
| MSCSM120XM31CTYZBNMG | SiC mosfet | 3phase bridge + actuation |
1.2kV 64A |
| MSCSM70XM19CTYZBNMG | SiC mosfet | 3phase bridge + actuation |
700V 89A |
Table is of intended figures, and transposition may have introduced errors.
