These use the latest generation KIOXIA BiCS FLASH 3D flash memory with 3-bit-per-cell (triple-level cell, TLC) technology, and is available in a 132-BGA package.
Densities range from 512 gigabits (64 gigabytes) to 4 terabits (512 gigabytes) to support the unique requirements of industrial applications – including telecommunication, networking and embedded computing.
The devices support the temperature range -40°C to +85°C.
Due to the fact that flash memory cell performance and reliability improve with a smaller number of bits per cell, the new KIOXIA devices feature 1-bit-per-cell (single-level cell, SLC) mode for applications that require faster read/write times and high cell endurance.
