What are the topics covered? There’s mobile phone satellite-based messaging, NXP sampling a 28nm RFCMOS radar one-chip IC family for ADAS, a 64bit quad-core RISC-V single-board computer, Intel’s process progress, and Apple planning to replace the iPhone Bluetooth/WiFi IC currently supplied by Broadcom…
5. CES: Bullitt to unveil satellite messaging service
Bullitt, the UK mobile phone manufacturer is unveiling two-way satellite messaging service – Bullitt Satellite Connect – at CES 2023. The service will be commercially available in Q1 2023. Motorola and Bullitt have confirmed that the next device in the range will be the first smartphone to support Bullitt’s satellite messaging service. The companies have a strategic brand partnership to develop rugged mobile phones under the Motorola brand and are reinforcing this commitment with the launch of this highly advanced connectivity feature in a Motorola smartphone.
4. NXP adds to RFCMOS radar ICs
NXP is sampling a 28nm RFCMOS radar one-chip IC family for ADAS. The SAF85xx one-chip family combines NXP’s high performance radar sensing and processing technologies into a single device, offering tier ones and OEMs new flexibility in addressing short, medium and long range radar applications to serve ever more challenging NCAP safety requirements. The SAF85xx offers twice the RF performance and accelerates radar signal processing by up to 40%, compared to NXP’s previous generation.
3. Quad-core Risc-V development board with 3D GPU in Pico-ITX
VisionFive 2 from Shanghai-based StarFive is a 64bit quad-core RISC-V single-board computer with 3D graphics. Based on the company’s own JH7110 multimedia processor, it has interfaces including: dual Ethernet, DVP, MIPI, HDMI, PCIe, USB (2×3.0, 2×2.0), SDIO and stereo audio output – as well as a 40pin GPIO header. StarFive U7 SoC IPThe JH7110 SoC has the company’s U74 processor, which has RV64GC cores and 2Mbyte of L2 cache running at up to 1.5GHz, plus an Imatination Technologies GPU and H264/H265 video.
2. Intel’s Process Progress
Intel put up a foil at IEDM showing its progress on delivering five process nodes in four years. “I was skeptical Intel could meet the original Intel accelerated timeline, then they pulled it in (18A moved from 2025 to the second half of 2024), and so far, they are meeting it,” comments Scotten Jones in Catawiki, adding “Intel is clearly back as a leading technology innovator.”
1. Apple to replace Broadcom IC with in-house designed part
Apple is to replace the iPhone Bluetooth/WiFi IC currently supplied by Broadcom with an in-house chip by 2025, reports Bloomberg. Apple is Broadcom’s largest customer representing about 20% of Broadcom’s revenue last FY worth $7 billion. The replacement chip is said to integrate the cellular modem with the Wi-Fi and Bluetooth functions. Apple is pursuing a long-term strategy of making its own silicon.